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1

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Effect of CMP slurry environments on subcritical crack growth in ultra low-k dielectric materials

Guyer, E.P., Dauskardt, R.H.

Year:

2003

Language:

english

File:

PDF, 174 KB

english, 2003

2

Microstructural damage and fracture processes in a composite solid rocket propellant

Bencher, C. D., Dauskardt, R. H., Titchie, R. O.

Journal:

Journal of Spacecraft and Rockets

Year:

1995

Language:

english

File:

PDF, 1.12 MB

english, 1995

3

Adhesion and Reliability of Polymer/Inorganic Interfaces

Kook, S.-Y., Snodgrass, J. M., Kirtikar, A., Dauskardt, R. H.

Journal:

Journal of Electronic Packaging

Year:

1998

Language:

english

File:

PDF, 1.15 MB

english, 1998

4

Environmental Effects on Interfacial Adhesion

M.W. Lane, J.M. Snodgrass, R.H. Dauskardt

Journal:

Microelectronics Reliability

Year:

2001

File:

PDF, 700 KB

2001

5

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - UV Curing Effects on Glass Structure and Mechanical Properties of Organosilicate Low-k Thin Films

Gage, D.M., Guyer, E.P., Stebbins, J.F., Zhenjiang Cui,, Amir Al-Bayati,, Demos, A., MacWilliams, K.P., Dauskardt, R.H.

Year:

2006

Language:

english

File:

PDF, 379 KB

english, 2006

6

High yield four-point bend thin film adhesion testing techniques

Ryan P. Birringer, Paula J. Chidester, Reinhold H. Dauskardt

Journal:

Engineering Fracture Mechanics

Year:

2011

Language:

english

File:

PDF, 502 KB

english, 2011

7

Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging

Jenkins, Maura, Snodgrass, Jeffrey, Chesterman, Aaron, DeVries, Gretchen, Dauskardt, Reinhold H., Bravman, John C.

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 32 KB

english, 2001

8

Financial improvement planning in local governments in Southern Africa, with special reference to Zambia

Dauskardt, Rolf PA

Journal:

Development Southern Africa

Year:

2004

Language:

english

File:

PDF, 179 KB

english, 2004

9

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Accelerated crack growth of nanoporous low-k glasses in CMP slurry environments

Guyer, E.P., Dauskardt, R.H.

Year:

2004

Language:

english

File:

PDF, 235 KB

english, 2004

10

Reconstructing South African cities: Contemporary strategies and processes in the urban core

Journal:

Year:

1993

Language:

english

File:

PDF, 1.56 MB

english, 1993

11

Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

Fujiwara, Shinichi, Dauskardt, Reinhold H.

Journal:

Journal of the Japan Institute of Metals

Year:

2014

Language:

english

File:

PDF, 6.10 MB

english, 2014

12

Cyclic fatigue-crack propagation along ceramic/metal interfaces

Cannon, R.M., Dalgleish, B.J., Dauskardt, R.H., Oh, T.S., Ritchie, R.O.

Journal:

Acta Metallurgica et Materialia

Year:

1991

Language:

english

File:

PDF, 1.31 MB

english, 1991

13

Characteristic of silver doped DLC films on surface properties and protein adsorption

Choi, Heon Woong, Dauskardt, Reinhold H., Lee, Seung-Cheol, Lee, Kwang-Ryeol, Oh, Kyu Hwan

Journal:

Diamond and Related Materials

Year:

2008

Language:

english

File:

PDF, 1015 KB

english, 2008

14

Thermal cycling effect on mechanical integrity of inverted polymer solar cells

Balcaen, Veerle, Rolston, Nicholas, Dupont, Stephanie R., Voroshazi, Eszter, Dauskardt, Reinhold H.

Journal:

Solar Energy Materials and Solar Cells

Year:

2015

Language:

english

File:

PDF, 1.79 MB

english, 2015

15

Fundamental limits of material toughening in molecularly confined polymers

Isaacson, Scott G., Lionti, Krystelle, Volksen, Willi, Magbitang, Teddie P., Matsuda, Yusuke, Dauskardt, Reinhold H., Dubois, Geraud

Journal:

Nature Materials

Year:

2015

Language:

english

File:

PDF, 855 KB

english, 2015

16

Molecular Intercalation and Cohesion of Organic Bulk Heterojunction Photovoltaic Devices

Bruner, Christopher, Miller, Nichole C., McGehee, Michael D., Dauskardt, Reinhold H.

Journal:

Advanced Functional Materials

Year:

2013

Language:

english

File:

PDF, 870 KB

english, 2013

17

Depth dependence of ultraviolet curing of organosilicate low-k thin films

Kim, Taek-Soo, Tsuji, Naoto, Kemeling, Nathan, Matsushita, Kiyohiro, Chumakov, Dmytro, Geisler, Holm, Zschech, Ehrenfried, Dauskardt, Reinhold H.

Journal:

Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 933 KB

english, 2008

18

[IEEE 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC) - Portland, OR, USA (2016.6.5-2016.6.10)] 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC) - Mechanical integrity of solution-processed perovskite solar cells

Rolston, Nicholas, Watson, Brian L., Dauskardt, Reinhold H.

Year:

2016

Language:

english

File:

PDF, 746 KB

english, 2016

19

A Mechanomodulatory Device to Minimize Incisional Scar Formation

Wong, Victor W., Beasley, Bill, Zepeda, John, Dauskardt, Reinhold H., Yock, Paul G., Longaker, Michael T., Gurtner, Geoffrey C.

Journal:

Advances in Wound Care

Year:

2013

Language:

english

File:

PDF, 1.20 MB

english, 2013

20

Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper/dielectric diffusion barrier films

R. P. Birringer, R. Shaviv, R. H. Geiss, D. T. Read, R. H. Dauskardt

Year:

2011

Language:

english

File:

PDF, 2.05 MB

english, 2011

21

An Artificial Solid Electrolyte Interphase with High Li-Ion Conductivity, Mechanical Strength, and Flexibility for Stable Lithium Metal Anodes

Liu, Yayuan, Lin, Dingchang, Yuen, Pak Yan, Liu, Kai, Xie, Jin, Dauskardt, Reinhold H., Cui, Yi

Journal:

Advanced Materials

Year:

2017

Language:

english

File:

PDF, 6.06 MB

english, 2017

22

Plasticity contributions to interface adhesion in thin-film interconnect structures

Lane, Michael, Dauskardt, Reinhold H., Vainchtein, Anna, Gao, Huajian

Journal:

Journal of Materials Research

Year:

2000

Language:

english

File:

PDF, 1.05 MB

english, 2000

23

Improved Efficiency and Stability of Perovskite Solar Cells with Submicron Flexible Barrier Films Deposited in Air

Rolston, Nicholas John, Printz, Adam D., Hilt, Florian, Hovish, Michael Q, Brüning, Karsten, Tassone, Christopher J., Dauskardt, Reinhold H.

Journal:

Journal of Materials Chemistry A

Year:

2017

Language:

english

File:

PDF, 3.29 MB

english, 2017

24

Engineering the Mechanical Properties of Polymer Networks with Precise Doping of Primary Defects

Chan, Doreen, Ding, Yichuan, Dauskardt, Reinhold H., Appel, Eric A.

Journal:

ACS Applied Materials & Interfaces

Year:

2017

Language:

english

File:

PDF, 6.01 MB

english, 2017

25

Emollient Structure and Chemical Functionality Effects on the Biomechanical Function of Human Stratum Corneum

Berkey, Christopher, Kanno, David, Mehling, Annette, Koch, Jan Peter, Eisfeld, Wolf, Dierker, Markus, Bhattacharya, Sandip, Dauskardt, Reinhold H.

Journal:

International Journal of Cosmetic Science

Year:

2020

File:

PDF, 4.55 MB

2020

26

Tailored amorphous silicon carbide barrier dielectrics by nitrogen and oxygen doping

Matsuda, Yusuke, King, Sean W., Dauskardt, Reinhold H.

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 755 KB

english, 2013

27

Integration Challenges of Nanoporous Low Dielectric Constant Materials

Taek-Soo Kim,, Dauskardt, R.H.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 1.02 MB

english, 2009

28

A Silica-Aerogel-Reinforced Composite Polymer Electrolyte with High Ionic Conductivity and High Modulus

Lin, Dingchang, Yuen, Pak Yan, Liu, Yayuan, Liu, Wei, Liu, Nian, Dauskardt, Reinhold H., Cui, Yi

Journal:

Advanced Materials

Year:

2018

Language:

english

File:

PDF, 8.38 MB

english, 2018

29

Spatially Resolved Raman Spectroscopy Study of Transformed Zones in Magnesia-Partially-Stabilized Zirconia

Reinhold H. Dauskardt, D. Kirk Veirs, Robert O. Ritchie

Journal:

Journal of the American Ceramic Society

Year:

1989

Language:

english

File:

PDF, 861 KB

english, 1989

30

Stress wave interference effects during fracture of silicon micromachined specimens

A. M. Fitzgerald, T. W. Kenny, R. H. Dauskardt

Journal:

Experimental Mechanics

Year:

2003

Language:

english

File:

PDF, 1.06 MB

english, 2003

31

Tuning depth profiles of organosilicate films with ultraviolet curing

Kim, Taek-Soo, Tsuji, Naoto, Matsushita, Kiyohiro, Kobayashi, Nobuyoshi, Chumakov, Dmytro, Geisler, Holm, Zschech, Ehrenfried, Dauskardt, Reinhold H.

Journal:

Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 1.02 MB

english, 2008

32

Effects of thermal annealing and Si incorporation on bonding structure and fracture properties of diamond-like carbon films

Choi, Heon Woong, Gage, David M., Dauskardt, Reinhold H., Lee, Kwang-Ryeol, Oh, Kyu Hwan

Journal:

Diamond and Related Materials

Year:

2009

Language:

english

File:

PDF, 653 KB

english, 2009

33

Bondability of Cu wire on Cu substrate with Sn plating by ultrasonic

Fujiwara, Shinichi, Dauskardt, Reinhold H.

Journal:

Welding International

Year:

2015

Language:

english

File:

PDF, 331 KB

english, 2015

34

Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films

Gage, David M., Peng, Luming, Stebbins, Jonathan, Yim, Kang Sub, Al-Bayati, Amir, Demos, Alex, Dauskardt, Reinhold H.

Journal:

International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde)

Year:

2010

Language:

english

File:

PDF, 377 KB

english, 2010

35

Fracture toughness and crack growth phenomena of plasma-etched single crystal silicon

A.M Fitzgerald, R.H Dauskardt, T.W Kenny

Journal:

Sensors and Actuators A: Physical

Year:

2000

Language:

english

File:

PDF, 584 KB

english, 2000

36

Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films

Gage, David M., Stebbins, Jonathan F., Peng, Luming, Cui, Zhenjiang, Al-Bayati, Amir, MacWilliams, Kenneth P., M’Saad, Hichem, Dauskardt, Reinhold H.

Journal:

Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 1.11 MB

english, 2008

37

Traditional medicine: Perspectives and policies in health care development

Dauskardt, R P A

Journal:

Development Southern Africa

Year:

1990

Language:

english

File:

PDF, 663 KB

english, 1990

38

Stress-Corrosion Cracking at Ceramic-Metal Interfaces

Card, J. C., Cannon, R. M., Dauskardt, R. H., Ritchie, R. O.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 560 KB

english, 1993

39

Synthesis and Use of a Hyper-Connecting Cross-linking Agent in the Hole-transporting Layer of Perovskite Solar Cells

Watson, Brian L., Rolston, Nicholas John, Bush, Kevin Alexander, Taleghani, Leila, Dauskardt, Reinhold H.

Journal:

Journal of Materials Chemistry A

Year:

2017

Language:

english

File:

PDF, 3.66 MB

english, 2017

40

Pore size scaling for enhanced fracture resistance of nanoporous polymer thin films

Andrew V. Kearney, Christopher S. Litteken, Carol E. Mohler, Michael E. Mills, Reinhold H. Dauskardt

Journal:

Acta Materialia

Year:

2008

Language:

english

File:

PDF, 442 KB

english, 2008

41

A novel micro-double cantilever beam (micro-DCB) test in an X-ray microscope to study crack propagation in materials and structures

Kutukova, Kristina, Niese, Sven, Gelb, Jeff, Dauskardt, Reinhold, Zschech, Ehrenfried

Journal:

Materials Today Communications

Year:

2018

Language:

english

File:

PDF, 2.19 MB

english, 2018

42

Adhesion and debonding of multi-layer thin film structures

R.H. Dauskardt, M. Lane, Q. Ma, N. Krishna

Journal:

Engineering Fracture Mechanics

Year:

1998

Language:

english

File:

PDF, 1.06 MB

english, 1998

43

Cyclic Fatigue-Crack Growth in a SiC-Whisker-Reinforced Alumina Ceramic Composite: Long- and Small-Crack Behavior

Reinhold H. Dauskardt, M. R. James, J. R. Porter, R. O. Ritchie

Journal:

Journal of the American Ceramic Society

Year:

1992

Language:

english

File:

PDF, 1.45 MB

english, 1992

44

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics

Kim, Taek-Soo, Konno, Tomohisa, Yamanaka, Tatsuya, Dauskardt, Reinhold H.

Year:

2008

Language:

english

File:

PDF, 3.04 MB

english, 2008

45

Important factors for silane adhesion promoter efficacy: surface coverage, functionality and chain length

Jenkins, M. L., Dauskardt, R. H., Bravman, J. C.

Journal:

Journal of Adhesion Science and Technology

Year:

2004

Language:

english

File:

PDF, 329 KB

english, 2004

46

Molecular-Scale Understanding of Cohesion and Fracture in P3HT:Fullerene Blends

Tummala, Naga Rajesh, Bruner, Christopher, Risko, Chad, Brédas, Jean-Luc, Dauskardt, Reinhold H.

Journal:

ACS Applied Materials & Interfaces

Year:

2015

Language:

english

File:

PDF, 3.48 MB

english, 2015

47

Low-temperature Al–Ge bonding for 3D integration

F. Crnogorac, F. R. W. Pease, R. P. Birringer, R. H. Dauskardt

Year:

2012

Language:

english

File:

PDF, 2.33 MB

english, 2012

48

Adhesion and degradation of hard coatings on poly (methyl methacrylate) substrates

Ani Kamer, Kjersta Larson-Smith, Liam S.C. Pingree, Reinhold H. Dauskardt

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 1.44 MB

english, 2011

49

Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

Lane, Michael, Dauskardt, Reinhold H., Krishna, Nety, Hashim, Imran

Journal:

Journal of Materials Research

Year:

2000

Language:

english

File:

PDF, 311 KB

english, 2000

50

Adhesion of benzocyclobutene-passivated silicon in epoxy layered structures

Hohlfelder, Robert J., Maidenberg, Daniel A., Dauskardt, Reinhold H., Wei, Yueguang, Hutchinson, W.

Journal:

Journal of Materials Research

Year:

2001

Language:

english

File:

PDF, 771 KB

english, 2001

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